Industrial IoT solution|Micro-machining|MKI

We provide precise and high-speed laser solutions for various applications such as micro-structuring, ablating,
cleaning, scribing, slitting, microfabricating, etc., by high-power ultra short pulse laser (maximum output: 1000 W)
and various optical units such as polygon scanner (maximum scanning speed: 200m/s).

【Advantages of our laser solutions】

・Burrs and heat affected zones (HAZ) free process.
・Fine and high precise machining process at high speed.
・Various materials, such as metals, resins, ceramics, glass, composite materials, can be processed.

Overview

Strong Points

Applications

Product specification

Contact

In partnership with L.P.S. Works Co., Ltd. (Headquarters: Tokyo), which is Japanese leading company in the laser micromachining field, we provide laser processing service to support your product development by our own laser systems equipped with high performance USP laser Amphos manufactured and manufacture custom-made laser systems

【Our laser systems for laser processing service】

1) For Large size samples / cylindrical samples
2) For Laser honing process

●With the conventional process (such as shot peening process, blast injection process …)

・Unevenness

・Difficult to control pattern such as shape, depth

・Edge shape is not smooth such as swelling and burrs
●With laser process…
　

・Laser micro-texturing processing

・Easy to control pattern precisely

・No burrs or swelling

●Conventional laser processing
Fine ceramicsSUS304
●USP laser processing
Fine ceramicsSUS304

【LiB electrode】

Graphite coated electrodeCurrent collector:
Copper foil10µm thick
thickness of coating: 205µm

NCM coated electrodeCurrent collector:
Aluminum foil 20µm thick
thickness of coating: 180µm

Si coated electrodeCurrent collector:
Nickelize steel foil 10µm thick
thickness of coating: 50µm

【Micro texturing】

Dimple processing

Embossing

Lattice processing

Through hole processing

Click here for more applications

【CFRP】(Plate thickness: 0.7mm)

6) Slit processting

【Water-repellent and hydrophilic processing by LIPSS】
　*LIPSS: Laser Induced Periodic Surface Structure

Water-repelling sample
Hydrophilic sample

【Cylindrical processing】

1) For Large size samples
　　and external surface of cylindrical samples

Wavelength (Amphos 200)	1030nm and 515nm
Pulse duration	800fs~10ps
Output power	200W(1030nm)/100W(515nm)@2MHz
Repetition	Max. 40MHz
Maximum samples size for cylindrical sample	Up to Φ300mm, length 600mm
Stage size	700mm×600mm
Rotational speed (for cylindrical sample)	Max. 2rps
Scanning speed (X-axis)	Max. 3000mm/sec
Optical system	【For cylindrical sample】Aberration-free condensing lens 【For large size sample】Ultra-high speed 2D polygon scanner Aberration-free condensing lens (X-axis NC motion processing) Galvano scanner

2) Laser honing equipment
　

Wavelength (Amphos 200)	1030nm and 515nm
Pulse duration	800fs~10ps
Output power	200W(1030nm)/100W(515nm)@2MHz
Repetition	Max. 40MHz
Processable cylinder inner diameter	Up to about Φ75~105mm
Processable cylinder length	Up to 250mm
Maximum speed	・Rotational speed(θaxis): 1500rpm 　(continuous) ・Z-axis: 500mm/sec
Helical set angle	0°< set angle < 90°
Processable groove width	About 15µm~40µm
Processable groove depth	About half the width or diameter

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Demonstration

L.P.S. Works Co., Ltd. https://lps-works.com/english/

409 OTA Techno CORE, 6-4-17 Higashi-Kojiya, Ota-ku, Tokyo, 144-0033

Location

■Contact Information

MITSUI KNOWLEDGE INDUSTRY CO., LTD.

Project Division, Machinery & Materials Unit
Tel. 03-6376-1343 Email. [email protected]